{"id":4755,"date":"2023-07-28T08:43:22","date_gmt":"2023-07-28T13:43:22","guid":{"rendered":"https:\/\/my.vanderbilt.edu\/vinsenews\/?p=4755"},"modified":"2023-10-12T19:20:31","modified_gmt":"2023-10-13T00:20:31","slug":"did-you-know-vinse-disco-dicing-saw","status":"publish","type":"post","link":"https:\/\/my.vanderbilt.edu\/vinsenews\/2023\/07\/did-you-know-vinse-disco-dicing-saw\/","title":{"rendered":"Did you know? VINSE DISCO Dicing Saw"},"content":{"rendered":"<p><a href=\"https:\/\/cdn.vanderbilt.edu\/vu-my\/wp-content\/uploads\/sites\/1669\/2023\/07\/28064806\/dicing-saw.png\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-4756\" src=\"https:\/\/cdn.vanderbilt.edu\/t2-my\/my-prd\/wp-content\/uploads\/sites\/1669\/2023\/07\/dicing-saw-650x287.png\" alt=\"dicing saw\" width=\"650\" height=\"287\" srcset=\"https:\/\/cdn.vanderbilt.edu\/t2-my\/my-prd\/wp-content\/uploads\/sites\/1669\/2023\/07\/dicing-saw-650x287.png 650w, https:\/\/cdn.vanderbilt.edu\/t2-my\/my-prd\/wp-content\/uploads\/sites\/1669\/2023\/07\/dicing-saw-300x133.png 300w, https:\/\/cdn.vanderbilt.edu\/t2-my\/my-prd\/wp-content\/uploads\/sites\/1669\/2023\/07\/dicing-saw-768x340.png 768w, https:\/\/cdn.vanderbilt.edu\/t2-my\/my-prd\/wp-content\/uploads\/sites\/1669\/2023\/07\/dicing-saw.png 1260w\" sizes=\"auto, (max-width: 650px) 100vw, 650px\" \/><\/a><\/p>\n<p>Did you know that the DISCO DAD3220 dicing saw can section blank and patterned substrates such as silicon, glass slides, sapphire, and more?\u00a0 You can fabricate multiple devices on one wafer and dice afterwards to save time and resources.\u00a0 The patterned devices can be coated with a layer of thin photoresist during the cutting for protection.<\/p>\n<p>Join us on August 15, 2023 from 10:00-11:30 in 226 ESB to hear from a DISCO representative about the capabilities of the DISCO\u00a0DAD3220 dicing saw in Vanderbilt University\u2019s VINSE\u00a0cleanroom, as well as other sample cutting techniques.\u00a0 Dicing is a standard microfabrication process to create\u00a0custom-sized substrates and devices for a variety of\u00a0electronic, optical, biomedical, and other applications.\u00a0\u00a0Silicon, sapphire, and fused quartz are commonly diced, but\u00a0other materials may be available.<\/p>\n<p><a href=\"https:\/\/www.vanderbilt.edu\/vinse\/facilities\/instruments\/dicing-saw.php\">Learn more about the VINSE\u00a0DISCO DAAD3220 Dicing Saw<\/a><\/p>\n<p>Get Access to VINSE &#8211;\u00a0<a href=\"https:\/\/www.vanderbilt.edu\/vinse\/facilities\/access.php\">New Vanderbilt Users<\/a><br \/>\nGet Access to VINSE &#8211;\u00a0<a href=\"https:\/\/www.vanderbilt.edu\/vinse\/facilities\/external_access.php\">External Users<\/a><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Did you know that the DISCO DAD3220 dicing saw can section blank and patterned substrates such as silicon, glass slides, sapphire, and more?\u00a0 You can fabricate multiple devices on one wafer and dice afterwards to save time and resources.\u00a0 The patterned devices can be coated with a layer of thin photoresist during the cutting for&#8230;<\/p>\n","protected":false},"author":3411,"featured_media":4756,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[330,1],"tags":[332,331,18],"class_list":["post-4755","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-did-you-know","category-news","tag-did-you-know","tag-instrumentation","tag-vinse-news"],"_links":{"self":[{"href":"https:\/\/my.vanderbilt.edu\/vinsenews\/wp-json\/wp\/v2\/posts\/4755","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/my.vanderbilt.edu\/vinsenews\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/my.vanderbilt.edu\/vinsenews\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/my.vanderbilt.edu\/vinsenews\/wp-json\/wp\/v2\/users\/3411"}],"replies":[{"embeddable":true,"href":"https:\/\/my.vanderbilt.edu\/vinsenews\/wp-json\/wp\/v2\/comments?post=4755"}],"version-history":[{"count":2,"href":"https:\/\/my.vanderbilt.edu\/vinsenews\/wp-json\/wp\/v2\/posts\/4755\/revisions"}],"predecessor-version":[{"id":4758,"href":"https:\/\/my.vanderbilt.edu\/vinsenews\/wp-json\/wp\/v2\/posts\/4755\/revisions\/4758"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/my.vanderbilt.edu\/vinsenews\/wp-json\/wp\/v2\/media\/4756"}],"wp:attachment":[{"href":"https:\/\/my.vanderbilt.edu\/vinsenews\/wp-json\/wp\/v2\/media?parent=4755"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/my.vanderbilt.edu\/vinsenews\/wp-json\/wp\/v2\/categories?post=4755"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/my.vanderbilt.edu\/vinsenews\/wp-json\/wp\/v2\/tags?post=4755"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}