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VINSE News & Events

VINSE News & Events

DISCO Dicing Saw Seminar

Posted by on Tuesday, November 8, 2022 in Events, News.

Patterned silicon wafer cut into individual dies.
Patterned silicon wafer cut into individual dies.

12.07.22 

ESB 001

1:30-4:00 PM

Please join us to learn about the capabilities of the DISCO DAD3220 dicing saw in Vanderbilt University’s VINSE cleanroom.  Representatives from DISCO will provide an overview of dicing applications and techniques. Dicing is a standard microfabrication process to create custom-sized substrates and devices for a variety of electronic, optical, biomedical, and other applications.  Silicon, sapphire, and fused quartz are commonly diced, but other materials may be available.

In addition, there will be a tour of the VINSE cleanroom and chance to meet the staff for discussion of dicing and other projects.

REGISTER HERE

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